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 IP4251/52/53/54
Integrated 4-, 6- and 8-channel passive filter network with ESD protection to IEC 61000-4-2, level 4
Rev. 03 -- 6 May 2009 Product data sheet
1. Product profile
1.1 General description
The IP425x family consists of 4-, 6- and 8-channel RC low-pass filter arrays which are designed to provide filtering of undesired RF signals on the I/O ports of portable communication or computing devices. In addition, the IP425x family incorporates diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages as high as 30 kV. The IP425x family is fabricated using monolithic silicon technology and integrates up to 8 resistors and 16 diodes in a 0.4 mm pitch 8-, 12- or 16-pin MicroPak (compatible with QFN) lead-free plastic package with a height of 0.5 mm only.
1.2 Features
I Pb-free, Restriction of the use of certain Hazardous Substances (RoHS) and dark green compliant I 4-, 6- and 8-channel integrated -type RC filter network I IP4251CZ8/CZ12/CZ16: 100 channel series resistance, 10 pF (at 2.5 V DC) channel capacitance I IP4252CZ8/CZ12/CZ16: 40 channel series resistance, 12 pF (at 2.5 V DC) channel capacitance I IP4253CZ8/CZ12/CZ16: 200 channel series resistance, 30 pF (at 2.5 V DC) channel capacitance I IP4254CZ8/CZ12/CZ16: 100 channel series resistance, 30 pF (at 2.5 V DC) channel capacitance I ESD protection to 30 kV contact discharge according to IEC 61000-4-2 standard far exceeding level 4 I MicroPak (QFN compatible) plastic package with 0.4 mm pitch
1.3 Applications
I General purpose ElectroMagnetic Interference (EMI) and Radio-Frequency Interference (RFI) filtering and downstream ESD protection for: N Cellular and Personal Communication System (PCS) mobile handsets N Cordless telephones N Wireless data (WAN/LAN) systems N PDAs
NXP Semiconductors
IP4251/52/53/54
Integrated 4-, 6- and 8-channel passive filter network
2. Pinning information
Table 1. Pin CZ8 1 and 8 2 and 7 3 and 6 4 and 5 ground pad CZ12 1 and 12 2 and 11 3 and 10 4 and 9 5 and 8 6 and 7 ground pad CZ16 1 and 16 2 and 15 3 and 14 4 and 13 5 and 12 6 and 11 7 and 10 8 and 9 ground pad filter channel 1 filter channel 2 filter channel 3 filter channel 4 filter channel 5 filter channel 6 filter channel 7 filter channel 8 ground
1 Transparent top view 8 GND
001aaf980
Pinning IP425xCZx Description filter channel 1 filter channel 2 filter channel 3 filter channel 4 ground
1 4 Transparent top view 8 5 1, 2, 3, 4
Cch 2 Cch 2 Rs(ch)
Simplified outline
Symbol
5, 6, 7, 8
GND
001aaf978
filter channel 1 filter channel 2 filter channel 3 filter channel 4 filter channel 5 filter channel 6 ground
1 Transparent top view 6 GND
001aaf979
12
7 1, 2, 3, 4, 5, 6
Rs(ch) Cch 2 Cch 2
7, 8, 9, 10, 11, 12
16
9 1, 2, 3, 4, 5, 6, 7, 8
Rs(ch) Cch 2 Cch 2
9, 10, 11, 12, 13, 14, 15, 16
IP4251_52_53_54_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 6 May 2009
2 of 16
NXP Semiconductors
IP4251/52/53/54
Integrated 4-, 6- and 8-channel passive filter network
3. Ordering information
Table 2. Ordering information Package Name IP4251CZ8-4 HXSON8U Description plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; UTLP based; body 1.35 x 1.7 x 0.5 mm Version SOT983-1 SOT984-1 SOT985-1 SOT983-1 SOT984-1 SOT985-1 SOT983-1 SOT984-1 SOT985-1 SOT983-1 SOT984-1 SOT985-1 Type number
IP4251CZ12-6 HXSON12U plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; UTLP based; body 1.35 x 2.5 x 0.5 mm IP4251CZ16-8 HXSON16U plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; UTLP based; body 1.35 x 3.3 x 0.5 mm IP4252CZ8-4 HXSON8U plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; UTLP based; body 1.35 x 1.7 x 0.5 mm
IP4252CZ12-6 HXSON12U plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; UTLP based; body 1.35 x 2.5 x 0.5 mm IP4252CZ16-8 HXSON16U plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; UTLP based; body 1.35 x 3.3 x 0.5 mm IP4253CZ8-4 HXSON8U plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; UTLP based; body 1.35 x 1.7 x 0.5 mm
IP4253CZ12-6 HXSON12U plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; UTLP based; body 1.35 x 2.5 x 0.5 mm IP4253CZ16-8 HXSON16U plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; UTLP based; body 1.35 x 3.3 x 0.5 mm IP4254CZ8-4 HXSON8U plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; UTLP based; body 1.35 x 1.7 x 0.5 mm
IP4254CZ12-6 HXSON12U plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; UTLP based; body 1.35 x 2.5 x 0.5 mm IP4254CZ16-8 HXSON16U plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; UTLP based; body 1.35 x 3.3 x 0.5 mm
IP4251_52_53_54_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 6 May 2009
3 of 16
NXP Semiconductors
IP4251/52/53/54
Integrated 4-, 6- and 8-channel passive filter network
4. Limiting values
Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC Vesd Parameter supply voltage electrostatic discharge voltage all pins to ground contact discharge IP4251 and IP4252 IP4253 and IP4254 air discharge IP4253 and IP4254 IEC 61000-4-2, level 4; all pins to ground contact discharge air discharge Pch Ptot Tstg Tamb
[1] [2] [3]
[2][3] [1][3] [2][3]
Conditions
Min -0.5
Max +5.6
Unit V
-15 -30 -30
+15 +30 +30
kV kV kV
-8 -15 -55 -40
+8 +15 60 200 +150 +85
kV kV mW mW C C
channel power dissipation Tamb = 85 C total power dissipation storage temperature ambient temperature Tamb = 85 C
Device is qualified using contact discharges at 15 kV according IEC 61000-4-2 model, far exceeding level 4. Device is qualified using contact discharges at 30 kV according IEC 61000-4-2 model, far exceeding level 4. A special robust test is performed stressing the devices with 1000 contact discharges according IEC 61000-4-2 model. All devices far exceed IEC 61000-4-2, level 4.
5. Thermal characteristics
Table 4. Symbol Rth(j-pcb)
[1]
Thermal characteristics Parameter Conditions Typ 120[1] Unit K/W thermal resistance from junction to 2 layer printed-circuit printed-circuit board board
Depends on layout details.
IP4251_52_53_54_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 6 May 2009
4 of 16
NXP Semiconductors
IP4251/52/53/54
Integrated 4-, 6- and 8-channel passive filter network
6. Characteristics
Table 5. Channel resistance Tamb = 25 C unless otherwise specified. Symbol Rs(ch) Parameter Conditions IP4252CZ8/CZ12/CZ16 IP4253CZ8/CZ12/CZ16 IP4254CZ8/CZ12/CZ16 Table 6. Channel characteristics Tamb = 25 C unless otherwise specified. Symbol Cch Parameter channel capacitance Conditions for the total channel; f = 100 kHz Vbias(DC) = 2.5 V IP4251 IP4252 IP4253 and IP4254 Vbias(DC) = 0 V IP4251 IP4252 IP4253 and IP4254 ILR VBR VF
[1]
[1] [1] [1]
Min 80 32 160 80
Typ 100 40 200 100
Max 120 48 240 120
Unit
channel series resistance IP4251CZ8/CZ12/CZ16
Min
Typ
Max
Unit
5.8 0.4
10 12 30 15 18 45 -
0.1 9 1.5
pF pF pF pF pF pF A V V
reverse leakage current breakdown voltage forward voltage
Guaranteed by design.
per channel; VI = 3.5 V positive clamp; II = 1 mA negative clamp; IF = 1 mA
IP4251_52_53_54_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 6 May 2009
5 of 16
NXP Semiconductors
IP4251/52/53/54
Integrated 4-, 6- and 8-channel passive filter network
Table 7. Frequency characteristics Tamb = 25 C unless otherwise specified. Symbol il Parameter insertion loss Conditions Rsource = 50 ; RL = 50 800 MHz < f < 3 GHz f = 1 GHz ct crosstalk attenuation Rsource = 50 ; RL = 50 ; 800 MHz < f < 3 GHz Rsource = 50 ; RL = 50 800 MHz < f < 3 GHz f = 1 GHz ct crosstalk attenuation Rsource = 50 ; RL = 50 ; 800 MHz < f < 3 GHz Rsource = 50 ; RL = 50 800 MHz < f < 3 GHz f = 1 GHz ct crosstalk attenuation Rsource = 50 ; RL = 50 ; 800 MHz < f < 3 GHz Rsource = 50 ; RL = 50 800 MHz < f < 3 GHz f = 1 GHz ct crosstalk attenuation Rsource = 50 ; RL = 50 ; 800 MHz < f < 3 GHz 30 28 30 dB dB dB 35 33 30 dB dB dB 12 14 40 dB dB dB 16 20 30 dB dB dB Min Typ Max Unit IP4251CZ8/CZ12/CZ16
IP4252CZ8/CZ12/CZ16 il insertion loss
IP4253CZ8/CZ12/CZ16 il insertion loss
IP4254CZ8/CZ12/CZ16 il insertion loss
7. Application information
7.1 Insertion loss
The IP425x family is mainly designed as EMI/RFI filters for multi-channel interfaces. The measured insertion loss in a 50 system for IP4251, IP4253 and IP4254 and the simulated insertion loss for IP4252 is depicted in Figure 2. The insertion loss was measured using the test set-up as depicted in Figure 1.
IP4251_52_53_54_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 6 May 2009
6 of 16
NXP Semiconductors
IP4251/52/53/54
Integrated 4-, 6- and 8-channel passive filter network
0 S21 (dB) -10
001aaj308
-20
(1) (2) (3) (4)
-30 IN
50
DUT
OUT
50
-40
Vgen
-50 10-1
001aag218
1
10
102
103 104 f (MHz)
(1) IP4252CZ16 - ch1 to ch16 (2) IP4251CZ16 - ch1 to ch16 (3) IP4254CZ16 - ch1 to ch16 (4) IP4253CZ16 - ch1 to ch16
Fig 1.
Frequency response set-up
Fig 2.
IP425x family frequency response curves
0 S21 (dB) -10
001aaj608
0 S21 (dB) -10
001aaj609
-20
(1) (2)
-20
(1) (2)
-30
-30
-40
-40
-50 10-1
1
10
102
103 104 f (MHz)
-50 10-1
1
10
102
103 104 f (MHz)
(1) IP4251CZ16 - ch1 to ch16 (2) IP4251CZ16 - ch4 to ch13
(1) IP4252CZ16 - ch1 to ch16 (2) IP4252CZ16 - ch4 to ch13
Fig 3.
IP4251 frequency response curves
Fig 4.
IP4252 frequency response curves
IP4251_52_53_54_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 6 May 2009
7 of 16
NXP Semiconductors
IP4251/52/53/54
Integrated 4-, 6- and 8-channel passive filter network
0 S21 (dB) -10
001aaj610
0 S21 (dB) -10
001aaj611
-20
-20
-30
(1) (2)
-30
(1) (2)
-40
-40
-50 10-1
1
10
102
103 104 f (MHz)
-50 10-1
1
10
102
103 104 f (MHz)
(1) IP4253CZ16 - ch1 to ch16 (2) IP4253CZ16 - ch4 to ch13
(1) IP4254CZ16 - ch4 to ch13 (2) IP4254CZ16 - ch1 to ch16
Fig 5.
IP4253 frequency response curves
Fig 6.
IP4254 frequency response curves
Due to the optimized silicon dice and package design, all channels in a single package show a very good matching performance as the insertion loss for a channel at the package side (e.g. ch1 to ch16) is nearly identical with the center channels (e.g. ch4 to ch13). Typical measurements results are shown in Figure 3 to Figure 6 for the different devices.
7.2 Selection
The IP425x family is mainly designed as EMI/RFI filters for multi-channel interfaces. The selection of one of the filter devices has to be performed dependent on the maximum clock frequency, driver strength, capacitive load of the sink, and also the maximum applicable rise and fall times.
7.2.1 SD(HC) and MMC memory interface
The Secure Digital High Capacity (SDHC) memory card interface standard specification and the MultiMediaCard (MMC) (JESD 84A43) standard specification recommend a rise and fall time of 25 % to 62.5 % (62.5 % to 25 % respectively) of 3 ns or less for the input signal of the receiving interface side. Assuming a typical capacitance of about 20 pF for the SDHC memory card itself, and approximately 4 pF to 7 pF for the PCB and the card holder, IP4252CZ12-6 (6 channels, Rs(ch) = 40 , Cch = 12 pF at Vbias(DC) = 2.5 V) is a matching selection to filter and protect all relevant interface pins such as CLK, CMD, and DAT0 to DAT3/CD. Please refer to Figure 7 for a general example of the implementation of the IP4252 in an SD(HC) card interface. In case additional channels such as write-protect or a mechanical card detection switch are used, the IP4252CZ16-8 (8 channels, Rs(ch) = 40 , Cch = 12 pF at Vbias(DC) = 2.5 V) offers two additional channels.
IP4251_52_53_54_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 6 May 2009
8 of 16
NXP Semiconductors
IP4251/52/53/54
Integrated 4-, 6- and 8-channel passive filter network
to HOST INTERFACE DAT3/CD pull-up 10 k - 100 k
VCC(VSD)
pull-up resistors 10 k - 100 k
IP4252CZ12-6 (IP4252CZ16-8)
DAT1 DAT0 CLK CMD DAT3/CD DAT2 CD WP DAT1 DAT0 GND CLK VCC(VSD) CMD DAT3/CD DAT2 SD MEMORY CARD SET_CLR_ CARD_DETECT (ACMD42) 10 k - 90 k
DAT3/CD pull-up >270 k exact value depends on required logic levels
optional: 2-additional channels of IP4252CZ16-8
optional: electrical card detect CD
WP
optional: card detect switch
optional: write protect switch
001aaj310
Fig 7.
Example of IP4252 in an SD(HC) card interface
The capacitance values specified for the signal channels of the MMC interface differ from the SD(HC) specification. The MMC card side interface is specified to have an intrinsic capacitance of 12 pF to 18 pF and the total channel is limited according the specification to 30 pF only. Therefore, any filter device capacitance is limited to a maximum of up to 18 pF, including the card holder and PCB traces. Please refer to Figure 8 for a general example of the implementation of the IP4252 in a MultiMediaCard interface application.
IP4251_52_53_54_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 6 May 2009
9 of 16
NXP Semiconductors
IP4251/52/53/54
Integrated 4-, 6- and 8-channel passive filter network
VCC(VMMC)
CMD pull-up 4.7 k - 100 k
pull-up resistors 50 k - 100 k
IP4252CZ12-6
DAT1 DAT0 DAT7 DAT6 CLK DAT5 HOST INTERFACE DAT1 DAT0 DAT7 VSS2 DAT6 C8 C7 C13 C6
C12 CLK C5 VCC(VMMC) C4 VSS1 DAT5 C3
e.g. RSMMC
CMD DAT4 DAT3 DAT2
CMD DAT4 DAT3 DAT2
C11 C2 C10 C1 C9
001aaj309
IP4252CZ8-4
Fig 8.
Example of IP4252 in an MMC interface
To generate SDHC- and MMC-compliant digital signals, the driver strength should not significantly undercut 8 mA.
7.2.2 LCD interfaces, medium-speed interfaces
For digital interfaces such as LCD display interfaces running at clock speeds between 10 MHz and 25 MHz or more, IP4251, IP4252, or IP4254 can be used in dependency of the sink load, clock speed, driver strength and rise and fall time requirements. Also the minimum EMI filter requirements may be a decision-making factor.
7.2.3 Keypad, low-speed interfaces
Especially for lower-speed interfaces such as keypads, low-speed serial interfaces (e.g. RS232) and low-speed control signals, IP4253 (Rs(ch) = 200 , Cch = 30 pF at Vbias(DC) = 2.5 V) offers a very robust ESD protection and strong suppression of unwanted frequencies (EMI-filtering).
IP4251_52_53_54_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 6 May 2009
10 of 16
NXP Semiconductors
IP4251/52/53/54
Integrated 4-, 6- and 8-channel passive filter network
8. Package outline
HXSON8U: plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; UTLP based; body 1.35 x 1.7 x 0.5 mm
SOT983-1
X D B A
E
A A1
terminal 1 index area e1 1/2 e terminal 1 index area L1 L
1
detail X
e
b
4
v w
M M
CAB C
C y1 C y
Eh
8
5
Dh
0
0.5 scale
1 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 0.05 0.00 b 0.25 0.15 D 1.75 1.65 Dh 1.5 1.3 E 1.4 1.3 Eh 0.5 0.3 e 0.4 e1 1.2 L 0.35 0.15 L1 0.09 0.00 v 0.1 w 0.05 y 0.05 y1 0.1
OUTLINE VERSION SOT983-1
REFERENCES IEC --JEDEC JEITA ---
EUROPEAN PROJECTION
ISSUE DATE 07-01-12 07-11-14
Fig 9.
Package outline SOT983-1 (HXSON8U)
(c) NXP B.V. 2009. All rights reserved.
IP4251_52_53_54_3
Product data sheet
Rev. 03 -- 6 May 2009
11 of 16
NXP Semiconductors
IP4251/52/53/54
Integrated 4-, 6- and 8-channel passive filter network
HXSON12U: plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; UTLP based; body 1.35 x 2.5 x 0.5 mm
SOT984-1
X D B A
E
A A1
terminal 1 index area
detail X e1
terminal 1 index area L1 L
1
e
1/2 e
b
6
v w
M M
CAB C
C y1 C y
Eh
12
7
Dh
0
0.5 scale
1 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 0.05 0.00 b 0.25 0.15 D 2.55 2.45 Dh 2.3 2.1 E 1.4 1.3 Eh 0.5 0.3 e 0.4 e1 2 L 0.35 0.15 L1 0.09 0.00 v 0.1 w 0.05 y 0.05 y1 0.1
OUTLINE VERSION SOT984-1
REFERENCES IEC --JEDEC JEITA ---
EUROPEAN PROJECTION
ISSUE DATE 07-01-12 07-11-14
Fig 10. Package outline SOT984-1 (HXSON12U)
IP4251_52_53_54_3 (c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 6 May 2009
12 of 16
NXP Semiconductors
IP4251/52/53/54
Integrated 4-, 6- and 8-channel passive filter network
HXSON16U: plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; UTLP based; body 1.35 x 3.3 x 0.5 mm
SOT985-1
X D B A
E
A A1
terminal 1 index area
detail X e1
terminal 1 index area L1 L
1
e
1/2 e
b
8
v w
M M
CAB C
C y1 C y
Eh
16
9
Dh
0
0.5 scale
1 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 0.05 0.00 b 0.25 0.15 D 3.35 3.25 Dh 3.1 2.9 E 1.4 1.3 Eh 0.5 0.3 e 0.4 e1 2.8 L 0.35 0.15 L1 0.09 0.00 v 0.1 w 0.05 y 0.05 y1 0.1
OUTLINE VERSION SOT985-1
REFERENCES IEC --JEDEC JEITA ---
EUROPEAN PROJECTION
ISSUE DATE 07-01-12 07-11-14
Fig 11. Package outline SOT985-1 (HXSON16U)
IP4251_52_53_54_3 (c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 6 May 2009
13 of 16
NXP Semiconductors
IP4251/52/53/54
Integrated 4-, 6- and 8-channel passive filter network
9. Revision history
Table 8. Revision history Release date 20090506 Data sheet status Product data sheet Change notice Supersedes IP4253_54_CZ8_CZ12_CZ16_2 Document ID IP4251_52_53_54_3 Modifications: IP4253_54_CZ8_CZ12_CZ16_2 IP4253_54_CZ8_CZ12_CZ16_1
* *
Added product types IP4251x and IP4252x. Added chapter Section 7 "Application information". Product data sheet IP4253_54_CZ8_CZ12_CZ16_1 Objective data sheet -
20071108 20070209
IP4251_52_53_54_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 6 May 2009
14 of 16
NXP Semiconductors
IP4251/52/53/54
Integrated 4-, 6- and 8-channel passive filter network
10. Legal information
10.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
10.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
IP4251_52_53_54_3
(c) NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 -- 6 May 2009
15 of 16
NXP Semiconductors
IP4251/52/53/54
Integrated 4-, 6- and 8-channel passive filter network
12. Contents
1 1.1 1.2 1.3 2 3 4 5 6 7 7.1 7.2 7.2.1 7.2.2 7.2.3 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Application information. . . . . . . . . . . . . . . . . . . 6 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 SD(HC) and MMC memory interface . . . . . . . . 8 LCD interfaces, medium-speed interfaces . . . 10 Keypad, low-speed interfaces . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 6 May 2009 Document identifier: IP4251_52_53_54_3


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